Neuroscience

Drive micro-manufacturing to excellence!

Neuroscience

Precision Assembly and Manufacturing Solutions for Neuromodulation and Brain-Computer Interface Devices
Neuromodulation and brain-computer interface devices are evolving toward higher channel counts, smaller dimensions, and increasingly complex structures. Integrating microelectrodes, ultra-fine wires, implant-grade silicone, and precision components within limited spaces places stringent demands on micro-wire processing, electrode interconnection, insulation, silicone encapsulation, and precision assembly. These challenges become even more critical when transitioning products from prototypes to pilot and volume production.

Diagsensor has established a dedicated precision assembly and manufacturing platform for neuroscience devices, providing assembly services for implantable neuromodulation leads, paddle electrodes, cuff electrodes, and other complex electrode assemblies across DBS, SCS, PNS, VNS, and RNS applications. Our manufacturing capabilities include microelectrode welding and assembly, AWG50–AWG36 micro-wire processing, laser processing, medical-grade liquid silicone molding and encapsulation, adhesive backfilling, precision assembly, and integration of miniature sensors and functional modules.

Supported by an  ISO 13485 quality management system and ISO Class 7 cleanroom manufacturing, Diagsensor focuses on solving assembly, process control, and manufacturing consistency challenges throughout the transition from engineering prototypes → process development → pilot production → volume manufacturing. We help customers establish stable, repeatable, and scalable manufacturing processes, accelerating the transition of innovative neuroscience devices from development to commercial production.

 

From Precision Assembly to Scalable Manufacturing

Diagsensor provides integrated manufacturing support for neuromodulation and brain-computer interface devices. Leveraging our expertise in micro-wire processing, electrode assembly, silicone molding, and precision assembly, we support customers through the transition from engineering prototypes to pilot production and volume manufacturing, helping reduce manufacturing risks through stable processes and robust quality control.

Contact us to learn more about our capabilities, including:

  • Neuromodulation Electrode & Implantable Lead OEM/ODM
  • Microelectrode & Ultra-Fine Wire Precision Assembly
  • Medical-Grade Liquid Silicone Molding & Encapsulation
  • Miniature Sensor & Functional Module Integration
  • Prototype → Pilot Production → Volume Manufacturing Support
Neuromodulation Lead

Neuromodulation Lead

· Neuromodulation Lead Assembly
· Implant-Grade Silicone Molding
· Precision Laser Cutting 
· ISO Class 7 Cleanroom Manufacturing

Welding

Welding

· MinOD0.009mm Wire Welding

· Dissimilar Metal Welding

· Electrode Ring and Wire Welding

· FPC Flexible Plate Welding

· Fusion Welding

· Tin Welding

· Laser Welding

· Ultrasonic Welding

Assembly

Assembly

· Electrode Integration

· Bending Control Assembly Integration

· Multi-sensor Integration

· Multi-wire and Multi-cavity Tube Threading

· Catheter Reducing Nesting

· Hot Melt Forming

Adhesive

Adhesive

· Epoxy Glue Bonding

· Resin Glue Bonding

· UV Glue Bonding

· Silica Gel Preparation and Molding

· Heat Shrink Tube Processing

· Nickel-titanium Shape Assembly

· Thin Wire Coil (Prototyping)