How Could a Minor Design Change Suddenly Prevent an Adhesive from Curing?
Jun 23,2026
During a recent sensor component project, the customer made a minor adjustment to the product design. Although the adhesive materials remained unchanged, an unexpected issue arose during production: one of the adhesives failed to cure properly.
Based on the failure symptoms, the Diagsensor engineering team suspected catalyst poisoning within the adhesive system. We immediately conducted a single-factor analysis of the three different adhesives used in the product.
After multiple rounds of testing, we identified the true root cause.
The issue was not directly related to the design change. Instead, a recent shift in environmental humidity prevented volatile components in Adhesive B from being fully released. These residual volatiles interfered with the curing mechanism of Adhesive A, resulting in catalyst poisoning and, ultimately, incomplete curing.
Once the root cause was confirmed, we extended the baking time for Adhesive B to ensure that the volatile components were sufficiently released. This adjustment significantly improved the curing performance of Adhesive A.
But solving the immediate problem was only part of the work.
We also updated the relevant Work Instruction (WI), clearly defining the baking time, environmental conditions, and critical process parameters. In doing so, we transformed a one-time production issue into a standardized, traceable, and repeatable manufacturing practice—reducing the risk of similar failures in the future.
The real challenge in medical device OEM manufacturing is not simply whether a product can be assembled. It is whether the manufacturer can identify the true root cause when materials, product design, environmental conditions, and manufacturing processes interact—and then integrate the solution into a robust manufacturing system.
This is the value that the Diagsensor engineering team continues to build through every project.
Jun 23,2026
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